Swedish semiconductor startup’s APS™ patent portfolio continues to grow with xth U.S. patent, marking the company’s 10th pending global patent.

Atomic Layer Etching Pitch Splitting (APS) proven on more industry-leading wafers, doubling fin density and proving flexibility without EUV.

Swedish semiconductor startup to demonstrate 3-nanometer class FinFET structures made with APS™ on Intel Silicon at trade show.