We are proud to announce that our innovative APS™ (Atomic Layer Etch Pitch Splitting) technology has been recognized with top honors at the IC Taiwan Grand Challenge, standing out among more than 150 international startups. – October 20, 2025

AlixLabs is pleased to have announced the company’s latest APS™ advances at ECS 248. – October 16, 2025

USPTO grants approval for continuation of “Tetris” patent, expanding protection of AlixLabs’ APS™ technology – October 7, 2025

AlixLabs has been selected as a winning company from the third batch of the IC Taiwan Grand Challenge, an international competition that recognizes groundbreaking innovations in semiconductor and related technologies. – August 28, 2025

For the third consecutive year, AlixLabs has been recognized on the EE Times Silicon 100 list, cementing our place among the world’s most innovative semiconductor startups. – August 11, 2025

Co-financed by ASCENT+ and leveraging Fraunhofer IPMS metrology for advanced defect control, the collaboration aims to cut costs, reduce environmental footprint, and enhance water recycling. – August 7, 2025

Efforts with APS™ recognized for driving sustainable leading-edge semiconductor production. – June 28, 2025

New General Manager to drive the company's next growth phase at a time of crucial company expansion. – June 3, 2025

Swedish semiconductor startup’s APS™ patent portfolio continues to grow with new U.S. patent, marking the company’s 10th pending global patent. – May 6, 2025

Atomic Layer Etching Pitch Splitting (APS) proven on more industry-leading wafers, doubling fin density and proving flexibility without EUV. – April 10, 2025